POSITIONING METHOD FOR SEMICONDUCTOR WAFER WITH SUPPORT PLATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER AND POSITIONING DEVICE FOR SEMICONDUCTOR WAFER WITH SUPPORT PLATE USING IT

摘要

PROBLEM TO BE SOLVED: To provide a positioning method for a semiconductor wafer with a support plate capable of determining the edges of a work such as the semiconductor wafer on which the support plate is stuck and the support plate with high precision and capable of determining a proper handling position, and to provide a device using it. SOLUTION: Rotational scan by a laser beam having a predetermined wavelength is carried out across the circumferential edge of the rear face of a wafer W to whose pattern side a support plate G of a glass substrate is stuck via double-sided adhesive tape T and the circumferential edge of the support plate G while radiating the laser beam from a projector. The positional information about both edges acquired based on the reflected light from respective rear faces is utilized to obtain the distance between both edges, the center positions of both members and the displacement amount of the center position of the wafer W with respect to the center position of the support plate G, and position correction is carried out. COPYRIGHT: (C)2007,JPO&INPIT