| 摘要 |
A method for manufacturing semiconductor chip package comprising steps of: (a) preparing a lead frame which comprises a pair of opposing side rails which have a plurality of through holes on their upper surface; a die pad onto which a chip will be mounted; a pair of rows of leads, each row being disposed at both sides of the die pad at a distance; and tiebars for mechanically and integrally connecting said die pad to said side rails; (b) filling a resin compound between leads and curing the resin compound to make dambars; (c) attaching said chip to an upper surface of said die pad, and electrically connecting said chip to leads; (d) encapsulating said chip, said die pad, said dambars, a part of said leads and a part of said tiebars to give a package body which is still attached to said lead frame; and (e) cutting said tiebars from lead frame to separate an individual package; and (f) forming leads extending from the package to have an appropriate bend shape is provided.
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