<p>A method of manufacturing for a PC card, comprises the steps of:
(a) stamping metal covers to a size marginally larger than a mold in an injection molding process;(b) bending edges of said covers to generally conform to an intended shape of a frame element;(c) inserting the covers into a mold in an injection molding process where they are slightly sprung and thus secure themselves in position;(d) shooting plastic frame elements into the mold so that the edges of the covers become embedded in the frames;(e) removing said covers from said mold;(f) positioning a PCB between two covers; and(g) bonding the plastic frame elements together so that a package is formed.</p>
