| 摘要 |
PURPOSE:To avoid the adhesion of dust and a foreign matter on the surface of a semiconductor wafer, and to improve yield by oppositely facing and arranging a blow-off port and an exhaust duct on a washing tank while installing an ionizer to the blow-off port, etc. CONSTITUTION:A washing tank 1 and an overflow tank 2 are constituted integrally, and a blow-off port 5 for clean air and an exhaust duct 4 are faced oppositely and disposed to a case 3. An ionizer 10 is installed to the blow-off port 5 in order to give charges to clean air blown off toward the tank 1, the blow-off port 5 is partitioned into a slender opening extending in the lateral direction in order to send clean air under the state of a laminar flow as the blow-off port 5, and an intermediate parting plate 5a is mounted and the opening is divided into upper and lower sections. The ionizer 10 is composed of a bar electrode 10a and a needle electrode 10b arranged to the parting plate 5a at that time, positive and negative high voltage are applied to generate corona discharge, air in the peripheral air is ionized to positive and negative ions, and charges on a charged body are neutralized by ions having reversed polarity. Accordingly, the adhesion of dust and a foreign matter on the surface of a semiconductor wafer is avoided, thus improving yield.
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