| 摘要 |
<p>A circuit substrate, an assembly having the same, and a method for manufacturing the same are provided to enlarge and uniform a standoff distance between a flip chip and a flexible circuit substrate in comparison with conventional flexible circuit substrates. A circuit substrate attached to an integrated circuit chip includes an electrical trace(130) and a mounting pad(140) having a first surface, one or more sidewalls and a second surface, in which the first surface is attached to the electrical trace. A dielectric layer substantially covers one or more sidewalls of the mounting pad and has the uppermost surface substantially coplanar with the second surface of the mounting pad. A capping layer is formed on the second surface of the mounting pad.</p> |
