| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photoresist base material and composition excellent in heat resistance and having such properties as high sensitivity, high resolution, high suitability to microfabrication and high solubility. <P>SOLUTION: The photoresist base material comprises a spirocyclic compound represented by formula (I) or the like, wherein at least one of R<SP>1</SP>and R<SP>2</SP>is an acid-dissociable dissolution inhibiting group; R<SP>3</SP>-R<SP>6</SP>each represent hydrogen, a hydroxyl group, an alkoxyl group, a 1-12C linear aliphatic hydrocarbon group, a 3-12C branched aliphatic hydrocarbon group, a 3-20C aliphatic hydrocarbon group having a monocyclic or polycyclic structure, a phenyl group, a p-phenylphenyl group, a p-tert-butylphenyl group, an aromatic group represented by specific formula or a group configured by combining two or more of these groups; a and b are each an integer of 1-4; and c and d are each an integer of 1-3. <P>COPYRIGHT: (C)2009,JPO&INPIT |
