| 摘要 |
PURPOSE:To improve mold release properties, molding accuracy and surface accuracy, by a method wherein after formation of a mold release agent layer made of silicone containing a benzene ring inside a sealing material casting part of a resin mold, a thermosetting sealing, material is cast, and cured, and the mold is released. CONSTITUTION:A silicone solution containing a benzene ring diluted by an acetates is applied as a mold release agent layer to the side of a resin casting part of a resin mold for manufacturing a resin-sealed electronic parts and after removal of the acetate through drying, thermosetting resin is cast. Alkylphenyl silicone and aralkyl aralkyl modified silicone are preferable as the silicone containing the benzene ring of the mold release agent. Spray-up wherein it is apt to form an even mold release agent layer on an inner wall of a resin mold is general as its coating method. The amount of coating is so determined that the thickness of the mold release agent layer after removal of a solvent is 0.1-100mum. Removal of the solvent after coating of a mold release agent solution can be performed easily by only leaving the solvent still at a room temperature. |
