| 摘要 |
PURPOSE: An apparatus for absorbing a semiconductor substrate horizontal by vacuum is provided to increase vacuum absorption regarding a printed circuit board, by operating a stopper to press an upper surface of the printed circuit board while operating a cylinder to elevate a lifting material, so that the printed circuit board is unfolded while absorbed by vacuum. CONSTITUTION: The apparatus comprises a substrate fixing unit, a lifting material operating unit and a stopping unit(90). The substrate fixing unit is established in a lifting material(20) and inserted into a plurality of positions of the semiconductor substrate for fixing the positions. The lifting material operating unit is fixedly established on a bottom surface of a main plate and moves up and down the lifting material. The stopping unit presses a plurality of positions of the semiconductor substrate moving up by the lifting material operating unit and makes the semiconductor substrate become flat.
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