| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board which can increase the packaging density of electronic components and increase flexibility in the layout design of the board, and to provide an electronic apparatus including the printed wiring board. SOLUTION: On a circuit board 10, an insulating adhesive member 20 is bonded. The circuit board 10 has indication members 21 for indicating an area A where the adhesive member 20 is to be bonded. The indication members 21 are formed by adhesive or paint. Since the indication members 21 for indicating the bonding position of the adhesive member 20 are formed by paint or adhesive, it is not necessary to provide an extra space beforehand for indicating the bonding position and it is possible to form the indication members in the manufacturing process of the printed wiring board. Thus it is possible to increase the packaging density of electronic components mounted on the printed wiring board and increase flexibility in the layout design of the printed wiring board. COPYRIGHT: (C)2009,JPO&INPIT
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