MANUFACTURE OF RF MODULE USING BALL GRID ARRAY PACKAGE,申请号JP19960296552-传众专利搜索

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发明名称	MANUFACTURE OF RF MODULE USING BALL GRID ARRAY PACKAGE
摘要
申请公布号	JPH10144815(A)	申请公布日期	1998.05.29
申请号	JP19960296552	申请日期	1996.11.08
申请人	LG INF & COMMUN LTD	发明人	U JUNKAN
分类号	H01L23/12;H05K3/12;H05K3/34;(IPC1-7):H01L23/12	主分类号	H01L23/12
代理机构		代理人
主权项
地址

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