Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

摘要

An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

主权项

1. An apparatus for processing a substrate, said apparatus comprising:
a polishing section configured to polish a substrate; a transfer mechanism configured to transfer the substrate; and a cleaning section configured to clean and dry the polished substrate, said cleaning section having plural cleaning lines for cleaning plural substrates, wherein said plural cleaning lines include plural primary cleaning modules for performing a primary cleaning operation on the substrate and plural secondary cleaning modules for performing a secondary cleaning operation on the substrate, and wherein said plural primary cleaning modules are aligned along a vertical direction and said plural secondary cleaning modules are aligned along a vertical direction.