| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the residues of a tail on a gold bump of a second bonding point, and to stably perform bonding. <P>SOLUTION: After a gold wire 5 is connected to a bonding electrode 4 (a first bonding point), a capillary 6 is pressed against a top surface of the gold bump 10 previously formed on a bonding pad 3 (the second bonding point), to pressure-weld the gold wire 5 and the gold bump 10, for chapping the gold wire 5. Then the capillary 6 is slightly raised and a tip part of the capillary 6 is moved in a opposite direction to the direction of the bonding electrode 4 along the top surface of the gold bump 10 by about 40-120% of the diameter of the gold wire 5, to expand the chap. Then the gold wire 5 is drawn upward by clamping with a wire clamper 9, to cut the gold wire 5 at the part where the chap is formed. <P>COPYRIGHT: (C)2004,JPO |
