SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor device having a reliable contact is disclosed. The device includes a barrier film (5, 6) deposited on the bottom and side wall of a contact hole opened in a insulating film (3) at a predetermined position; a first metal film (7a) filled in the contact hole; and a second metal film (8) of low resistance for forming an interconnection which passes above the contact hole filled in with the first metal film. And a method of manufacturing the semiconductor device is disclosed. The method includes the steps of: after opening a contact hole at a predetermined position in an insulating film (3) deposited on a semiconductor substrate (1), forming a barrier film (5, 6) in the bottom and side wall of the contact hole; filling the contact hole with a first metal film (7a) while heating the semiconductor substrate at a predetermined temperature; and depositing a second metal film (8) over the surface of the semiconductor device and patterning the second metal film to form an interconnection which passes the contact hole that has been filled in with the first metal film.