| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a grinding pad for mechanically flattening the surface of an insulating layer or a metal wiring formed on a silicon substrate, in which the falling of diamond abrasive grains from a dresser upon dressing a grinding layer will not be caused while maintaining grinding characteristics, further, to provide a grinding device employing the grinding pad and a grinding method employing the device. <P>SOLUTION: (1) The amount of abrasion obtained by the taper abrasion test of a grinding layer is 400-1000mg. (2) The grinding device is provided with a grinding head, the grinding pad of (1) opposed to the grinding head, a grinding surface plate for fixing the grinding pad and a driving device for turning the grinding head and/or the grinding surface plate. (3) Grinding is effected by a method wherein a work to be ground is fixed to the grinding head, then, the grinding head and/or the grinding surface plate are turned under a condition that the grinding pad of (1), fixed to the grinding surface plate, is contacted with the work to be ground. <P>COPYRIGHT: (C)2004,JPO |
