发明名称 |
Connecting arrangement for connecting a fluid line to an assembly to be supplied with fluid |
摘要 |
A connecting arrangement connects an end of a fluid conduit to an assembly. The connecting arrangement includes a stub (1) having a flow opening (11) for receiving the fluid conduit at one end of the flow opening (11) as well as a flange (2) having a first opening (9) for receiving the stub (1) and a second opening (10) for fastening to the assembly. The stub (1) is inserted into the first opening (9) and connected to the flange (2) in a material-to-material manner. The flange (2) has in the region of the connection a groove (4) that extends in a circumferential direction. |
申请公布号 |
US9512943(B2) |
申请公布日期 |
2016.12.06 |
申请号 |
US201314013977 |
申请日期 |
2013.08.29 |
申请人 |
ContiTech Techno-Chemie GmbH |
发明人 |
Paust Marcus;Hahn Michael;Foik Juergen |
分类号 |
F16L13/08;F16L23/026 |
主分类号 |
F16L13/08 |
代理机构 |
Walter Ottesen, P.A. |
代理人 |
Walter Ottesen, P.A. |
主权项 |
1. A connecting arrangement for connecting an end of a fluid line to an assembly to be supplied with fluid, the connecting arrangement comprising:
a stub having a throughflow opening configured to receive the fluid line at one end thereof; a flange defining a first opening configured to receive said stub therein and conjointly defining an interference fit therewith and a second opening configured for fixing said flange on the assembly; said stub being inserted into said first opening of said flange and being connected thereto material-to-material in a firmly bonded manner via a solder connection; said flange having a flat surface and an annular groove formed in said flat surface and spaced radially outwardly from said first opening and so as to extend in a circumferential direction in the region whereat said stub is connected to said flange in said firmly bonded manner; said stub having a flat surface in surface-to-surface contact with said flat surface of said flange so as to define an interface therebetween; and, said groove being formed at said interface to collect excess solder therein and said groove being configured to break down a capillary action of said excess solder thereby preventing a flow of said excess solder from said groove. |
地址 |
Karben DE |