SUBCARRIER, POLISHING DEVICE INCOPORATING THEREOF AND MANUFACTURE OF WAFER

摘要

PROBLEM TO BE SOLVED: To provide a polishing device equipped with a subcarrier, and a method of manufacturing a wafer, wherein the subcarrier can flatlymirror- surface-finish a workpiece to be polished so as to allow the workpiece to have a uniform polished surface, and it is possible to enhance the productivity. SOLUTION: A subcarrier has a pressure receiving surface 21b which receive a static hydraulic pressure from a compressed air (fluid) in an air chamber (fluid chamber) and which has a large area in comparison with the area of 2 attaching surface 21a to which a wafer W (workpiece to be polished). With this arrangement, the pressure receiving surface 21b side overhangs outward from the outer peripheral part 21c of the attaching surface 21a so as to define an overhanging part 21d.