Probe apparatus applicable to a wafer level burn-in screening

摘要

A probe card is used for a burn-in screening or inspection applied to a semiconductor wafer. The probe includes a pressure substrate. An elastic member is disposed on the pressure substrate. A wiring substrate is disposed on the elastic member. A spacer is disposed on the pressure substrate and spaced radially outward from a periphery of the wiring substrate. A plurality of bumps are formed on a membrane disposed on the wiring substrate, with electric connection between the bumps and a wiring of the wiring substrate. A ceramic ring is disposed on the spacer for tightly holding a periphery of the membrane.