| 摘要 |
A method for selective plating and double injection is provided to plate partly a dual injection-molded material by approving electricity on a part by filling metal components on a region etched. A method for selective plating and double injection includes a step for performing double injection of a platable material and a nonplatable material, and a step for plating only the platable material of a molding(3,4). A partial plating step comprise an etching step for extracting butadiene components from a plate part, and a step for filling metal components to the plated part.
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