发明名称 RESIN-MADE MOLD AND PRODUCTION THEREOF
摘要 <p>PURPOSE:To obtain a resin-made mold having a high adhesive power between a thermosetting resin layer and a metallic back-up material and a superior durability by a method wherein a metallic material is used as the back-up material, a stress reduction resin layer is formed on the surface thereof, and thereon a thermosetting resin material is bonded. CONSTITUTION:In the construction of a resin-made mold, a metallic material is used as a back-up material, a stress reduction resin layer is formed on the surface thereof, and thereon a thermosetting resin material is bonded. The stress reduction material used in this invention is disposed between the thermosetting resin layer forming a molding surface and the metallic back-up material for the purpose of securely bonding the both to each other. If the thermosetting resin layer forming the molding surface is directly bonded to the metallic back-up material, a residual stress caused by a difference in linear expansion coefficient between the both occurs in the interface, thus resulting in a trouble, such as an occurrence of peeling. If the stress reduction material capable of effectively reducing the residual stress is provided on the interface, the adhesion can be improved to a great extent.</p>
申请公布号 JPH05269753(A) 申请公布日期 1993.10.19
申请号 JP19920068256 申请日期 1992.03.26
申请人 发明人
分类号 B29C33/40;B29K101/10;B32B37/00;(IPC1-7):B29C33/40;B29D9/00 主分类号 B29C33/40
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