| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device whose heat radiating property is superior and a method for manufacturing this device, without generating warpages of a metallic radiator or cracks of a ceramic frame body. SOLUTION: A semiconductor element 2 is loaded on the upper face of a metallic radiator 1 formed by jointing copper plates 12 with the both upper and lower faces of a molybdenum plate 11. A cover body 4 is jointed with a ceramic frame body 3 arranged on the upper face of the metallic radiator 1, and the semiconductor element 2 is airtightly sealed in air. The metallic radiator 1 is formed by forming a through-hole in the molybdenum plate 11, inserting a metallic piece 14, such as copper whose thermal conductivity is high into the through-hole, overlapping the copper plates 12 through silver solder 6 on the both upper and lower faces of the molybdenum plate 11, and then cooling it, and brazing the molybdenum plate 11, the copper plates 12, and the copper piece 14. |
