发明名称 METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATION CHIP
摘要 PROBLEM TO BE SOLVED: To solve a problem of a conventional manufacturing method that a number of manufacturing steps are required for a piezoelectric vibration chip because two drive side electrodes for the vibration chip and a single detection side electrode for a detection chip cannot be simultaneously formed. SOLUTION: A piezoelectric substrate is formed with a through-hole having a hollow part, and the formation of a metal film in the through-hole and the division of the piezoelectric substrate at a desired part are performed in the same step. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004364133(A) 申请公布日期 2004.12.24
申请号 JP20030162359 申请日期 2003.06.06
申请人 SEIKO EPSON CORP 发明人 HOKIBARA AKI;TAKEUCHI MANABU
分类号 H03H3/02;(IPC1-7):H03H3/02 主分类号 H03H3/02
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