发明名称 |
METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATION CHIP |
摘要 |
PROBLEM TO BE SOLVED: To solve a problem of a conventional manufacturing method that a number of manufacturing steps are required for a piezoelectric vibration chip because two drive side electrodes for the vibration chip and a single detection side electrode for a detection chip cannot be simultaneously formed. SOLUTION: A piezoelectric substrate is formed with a through-hole having a hollow part, and the formation of a metal film in the through-hole and the division of the piezoelectric substrate at a desired part are performed in the same step. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004364133(A) |
申请公布日期 |
2004.12.24 |
申请号 |
JP20030162359 |
申请日期 |
2003.06.06 |
申请人 |
SEIKO EPSON CORP |
发明人 |
HOKIBARA AKI;TAKEUCHI MANABU |
分类号 |
H03H3/02;(IPC1-7):H03H3/02 |
主分类号 |
H03H3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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