发明名称 Chip to dielectric waveguide interface for sub-millimeter wave communications link
摘要 In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth.
申请公布号 US9484630(B2) 申请公布日期 2016.11.01
申请号 US201514734371 申请日期 2015.06.09
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 Haroun Baher S.;Corsi Marco;Akhtar Siraj;Warke Nirmal C.
分类号 H01Q1/24;H01Q3/44;H01L23/66;H01Q3/26;H01Q9/04;H01L23/31;H01L23/00 主分类号 H01Q1/24
代理机构 代理人 Pessetto John R.;Brill Charles A.;Cimino Frank D.
主权项 1. An apparatus comprising: a housing having a receptacle formed therein, wherein the receptacle is adapted to receive at least a portion of a dielectric waveguide; and an integrated circuit (IC) secured within the housing, wherein the IC includes: a directional antenna that is adapted to provide a communication link with the dielectric waveguide; anda steering circuit that is coupled to the directional antenna, wherein the steering circuit is adapted to adjust the directional antenna to couple the IC with the dielectric waveguide when the receptacle and the directional antenna are misaligned.
地址 Dallas TX US
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