| 摘要 |
PROBLEM TO BE SOLVED: To provide a method capable of stabilizing the reaction rate of an electroless Ni/Au plating precipitation reaction at the time of forming an electroless Ni/Au plating film, within a controllable range, and forming an electroless Ni/Au plating film having an excellent corrosion resistance.SOLUTION: In a Ni/Au plated film forming method for forming a nickel coating on the circuit surface of a wiring circuit board and forming a gold plating film on the surface of said nickel coating, there is adopted an electroless Ni/Au plating film forming method or the like, which is characterized in that said nickel coating is formed by subjecting the circuit surface of the wiring circuit board to an electroless Ni strike plating and then to an electroless Ni plating.SELECTED DRAWING: Figure 1 |
