| 摘要 |
A heat treatment apparatus configured to perform a heat treatment on a plurality of substrates, including: a processing vessel configured to accommodate the plurality of substrates on which the heat treatment is performed; an electromagnetic induction source configured to generate an oscillating magnetic field having a high frequency within the processing vessel; and a substrate holding element having a plurality of heating elements arranged in a vertical direction and spacers interposed between the adjacent heating elements, the heating element being made of a conductive material and allowing an induced current caused by the oscillating magnetic field to flow therein to generate heat, the substrate holding element supporting the substrates in a state where the substrates are mounted on the heating elements. |
