<p>A circuit-component-containing module is provided which, when mounted onto a motherboard by use of solder, allows prevention of re-melted solder from outflowing from predetermined electrodes. A first groove (116) is formed in a solder resist (106) existing between two electrodes (103) to be connected to a circuit component (104). Then, a first insulating resin (107) is charged into a space between the first groove (116) and the circuit component (104).</p>
申请公布号
WO2004026010(A1)
申请公布日期
2004.03.25
申请号
WO2003JP11296
申请日期
2003.09.04
申请人
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;KAWAMOTO, EIJI;HAYAMA, MASAAKI;KATSUMATA, MASAAKI;YABE, HIROKI;YASUHO, TAKEO
