| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated semiconductor device that is hardly damaged in a mounting process. <P>SOLUTION: A first package 4 is mounted on a substrate 2 via bumps 3. A second package 6 is laminated on the first package 4. The bumps 3 are metal layers formed on the outer surface of resin cores 3a, and disposed to be able to electrically connect the substrate 2 and the first package 4. The resin cores 3a are made of materials having Young's moduli of 500 MPa to 10 GPa. <P>COPYRIGHT: (C)2007,JPO&INPIT |
