Package Structure and Methods of Forming Same

摘要

A semiconductor device, a package structure, and methods of forming the same are disclosed. An embodiment is a semiconductor device comprising a first optical device over a first substrate, a vertical waveguide on a top surface of the first optical device, and a second substrate over the vertical waveguide. The semiconductor device further comprises a lens capping layer on a top surface of the second substrate, wherein the lens capping layer is aligned with the vertical waveguide, and a second optical device over the lens capping layer.

主权项

1. A device comprising:
a first optical device on a first side of a first substrate; a vertical waveguide on a top surface of the first optical device; a second substrate bonded to the first side of the first substrate, the second substrate being over the vertical waveguide; and a lens capping layer on the second substrate, a portion of the second substrate being directly between the vertical waveguide and the lens capping layer.