发明名称 Verfahren zur Herstellung eines aus Kupfer oder Silber/Polyimid zusammengesetzten Artikels.
摘要 <p>The present invention provides a process for producing a metal/polyimide composite article such as high-density wiring boards. This metal (2)/polyimide (3) composite article is produced by a method which comprises coating a polyamic acid alkyl ester represented by the following formula on a metallic film (2) and curing it: <CHEM> wherein R1 and R2 which may be identical or different each represents an organic group of 1 or more carbon atoms.</p>
申请公布号 DE68914375(D1) 申请公布日期 1994.05.11
申请号 DE1989614375 申请日期 1989.09.28
申请人 HITACHI, LTD., TOKIO/TOKYO, JP;NITTO DENKO CORP., IBARAKI, OSAKA, JP 发明人 MIYAZAKI, KUNIO, HITACHI-SHI, JP;MIURA, OSAMU, HITACHI-SHI, JP;WATANABE, RYUJI, NAKA-GUN IBARAKI-KEN, JP;OOKOSHI, YUKIO, MITO-SHI, JP;MIYAMOTO, TOSHIO, TAKASAKI-SHI, JP;AIZAWA, MIKIO, FUKAYA-SHI, JP;IGARASHI, KAZUMASA, SUZUKA-SHI, JP;MOCHIZUKI, AMANE, FUKAYA-SHI, JP
分类号 C08G73/10;H01B1/22;H01B3/30;H01L21/48;H05K1/03;(IPC1-7):H05K1/03;H01L23/14 主分类号 C08G73/10
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