RESIN MOLDED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: To further increase the packing density and integration degree of a resin molded semiconductor device having a semiconductor element and reduce the size and thickness thereof by fixing other semiconductor element than that semiconductor element through adhesive members and bonding electrodes of the other element to leads through wires. CONSTITUTION: The title resin molded semiconductor device has polyimide tapes 2 and 3 as adhesive members at the upper and lower faces of leads 1 serving as electrodes whereby a semiconductor chip 4 is fixed by the tape 3 at the lower faces of the leads 1. A polyimide tape 5 is formed on the upper face of the chip 4 and the electrodes on the chip 4 are bonded to the upper faces of the leads 1 through bonding wires 6. A semiconductor chip 7 is fixed to the upper faces of the leads 1 through the tape 2 at the upper faces of the leads 1 and tape 5 attached to the chip 4, and the electrodes on the chip 7 are bonded to the upper faces of the leads 1 through bonding wires 8.