发明名称 POLYAMIC ACID DERIVATIVE
摘要 PROBLEM TO BE SOLVED: To provide a polyamic acid derivative that can give a cured polyimide resin coating having an extremely low residual stress and high glass transition temperature simultaneously. SOLUTION: This polyamic acid derivative comprises units 1 and units 2 represented by general formula (1), and has a number average molecular weight of 3,000-100,000. The polyimide resin after thermal curing has glass transition temperatures in the ranges of -150 to 0°C and 150 to 380°C, respectively. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005232383(A) 申请公布日期 2005.09.02
申请号 JP20040045295 申请日期 2004.02.20
申请人 ASAHI KASEI ELECTRONICS CO LTD 发明人 HANABATAKE HIROYUKI
分类号 C08G73/10;(IPC1-7):C08G73/10 主分类号 C08G73/10
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