| 摘要 |
PURPOSE:To prevent the breakdown of the main body of an IC due to mechanical or thermal shocks when molding bodies are bonded and to prevent the deterioration of an element due to accumulation of moisture in a gap of the inside of the molding bodies after bonding and sealing, by preheating the element at a temperature lower than the heating temperature of the resin molding bodies. CONSTITUTION:A unit comprising an IC and a lead frame is held with package shaped thermoplastic-resin molding bodies 6 and 7 at the upper and lower sides. A holding part 8 is heated at the molding temperature of the resin molding bodies, e.g., at 350 deg.C. Thus the resin molding bodies are bonded and sealed. The heating of the holding part is carried out as follows. At first the part is preheated at about 200 deg.C. Then the part is locally heated for a short time by a means such as ultrasonic-wave electric vibration, high frequency heating, infrared-ray heating or hot jet. Namely, the bonding parts are not heated and connected one time but are heated and connected (sealed) in a plurality of times (two times). Before main sealing, the part is preheated at a lower temperature. Thereafter, the frame is cut from leads, which are protruded to the outside, and the IC device of one unit is obtained. |
