发明名称 PROBE CARD STRUCTURE
摘要 The invention relates to a probe card structure, which comprises printed circuit board structure with a first through hole, a center stiffener with a second through hole, a first probe head module with a first through hole set and a plurality of first probe pins, and a second probe head module provided with a plurality of second probe pins. The first probe head module and the second probe head module are respectively arranged on a lower surface and an upper surface of the printed circuit board structure, wherein those first probe pins are set on a periphery of an opening of the first through hole set; and a portion of the second probe head module penetrating the first through hole, the second through hole, and the first through hole set. The first and second probe head module integrated together can be utilized for 3D IC testing.
申请公布号 US2016305982(A1) 申请公布日期 2016.10.20
申请号 US201615195130 申请日期 2016.06.28
申请人 Hermes-Epitek Corp. 发明人 HUNG Chien-Yao
分类号 G01R1/073;H05K1/18;H05K1/11;G01R31/28 主分类号 G01R1/073
代理机构 代理人
主权项 1. A probe card structure comprising: a printed circuit board structure, having an upper surface and a lower surface; and a first through hole penetrating said printed circuit board structure; a center stiffener set on said upper surface of said printed circuit board structure; and said center stiffener having a first opening and a second through hole penetrating said first opening; a first probe head module set on said lower surface of said printed circuit board structure and comprising a first through hole set and a plurality of first probe pins, wherein said first through hole, said second through hole, and said first through hole set are aligned vertically; said first probe head module is electrically connected with said printed circuit board structure; and said plurality of first probe pins set on a periphery of an opening of said first through hole set; and a second probe head module set on said upper surface of said printed circuit board structure, wherein said second probe head module comprises a plurality of second probe pins; a first portion of said second probe head module lain on said first opening and a second portion of said second probe head module penetrating said first through hole, said second through hole, and said first through hole set; said second probe head module is electrically connected with said printed circuit board structure; and said second probe pins set on said second portion of said second probe head module.
地址 Taipei City TW