| 发明名称 |
METHOD OF REDUCING RESIDUAL CONTAMINATION IN SINGULATED SEMICONDUCTOR DIE |
| 摘要 |
In one embodiment, semiconductor die are singulated from a semiconductor wafer by placing the semiconductor wafer onto a carrier tape, forming singulation lines through the semiconductor wafer, and reducing the presence of residual contaminates on the semiconductor wafer. |
| 申请公布号 |
US2016372323(A1) |
申请公布日期 |
2016.12.22 |
| 申请号 |
US201615255503 |
申请日期 |
2016.09.02 |
| 申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
DOUB Jason Michael;GRIVNA Gordon M. |
| 分类号 |
H01L21/02;H01L21/683;H01L21/3065;H01L21/78;H01L23/544 |
主分类号 |
H01L21/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
Phoenix AZ US |
