| 发明名称 |
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can be increased in packaging density and can accurately shut out electromagnetic waves, and also to provide its manufacturing method. <P>SOLUTION: On a sealing resin 14 which has difficulty in forming a conductive film thereon, a resin layer 15 is formed whose adhesiveness with the conductive film is higher than the sealing resin 14. Then, a wiring pattern 18 electrically connected to an electronic component 13 is arranged on the resin layer 15. <P>COPYRIGHT: (C)2007,JPO&INPIT |
| 申请公布号 |
JP2006310629(A) |
申请公布日期 |
2006.11.09 |
| 申请号 |
JP20050132539 |
申请日期 |
2005.04.28 |
| 申请人 |
SHINKO ELECTRIC IND CO LTD |
发明人 |
KOBAYASHI TOMOKI;SHIMADA NORIJI;INOUE AKIYOSHI;KAJIKI ATSUNORI;KATO HIROYUKI;SHIMIZU HIROSHI |
| 分类号 |
H05K9/00;H05K1/02;H05K3/28 |
主分类号 |
H05K9/00 |
| 代理机构 |
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| 主权项 |
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