| 摘要 |
<p>PURPOSE:To make it possible to detect definitely even a glass substrate which can not be detected optically by providing vibration to a means to hold or mount a processed body of a semiconductor device and analyzing the reflected waves thus produced. CONSTITUTION:In a processing device for a plasma etching, for example, detection devices 21 and 22 detect the presence of an LCD substrate in load lock chambers 6 and 10, and a holding state of handling arms 17 and 18. The detection device 21 is provided with a magnetic bar in a hammer coil 34, a vibration means, which generates micro-vibration when pulse current flows through the coil, and a receiving means, which detects the vibration of a magnet where a sensor coil 41 is installed on the outside periphery of the magnet fixedly provided to the aforesaid arm 17. The coils 34 and 41 are embedded into the arm 17. When pulse-like microvibration is partially applied to the arm 17, reflected waves are generated, but lag time during the force excitation of the reflected waves or frequency components may vary with the holding state, and the presence of the processed body. A microcomputer controls the force excitation and analyzes the aforesaid reflected waves. The same structure is adopted for the detection device 22 as well.</p> |
