| 发明名称 |
VARIOUS STRUCTURE/HEIGHT BUMPS FOR WAFER LEVEL-CHIP SCALE PACKAGE |
| 摘要 |
a substrate; two or more various shaped bump structures having a solder line formed over the substrate; and an epoxy layer formed over the substrate. The epoxy layer having a top surface wherein: (a) the solder lines are below the top surface of the epoxy layer' (b) the solder lines are above the top surface of the epoxy layer; or (c) some of the solder lines are below the top surface of the epoxy layer and some of the solder lines are above the top surface of the epoxy layer. |
| 申请公布号 |
KR20060130107(A) |
申请公布日期 |
2006.12.18 |
| 申请号 |
KR20067014339 |
申请日期 |
2006.07.14 |
| 申请人 |
ADVANPACK SOLUTIONS PTE LTD. |
发明人 |
CH'NG HAN SHEN;LIM ENG HAN MATTHEW |
| 分类号 |
H01L23/50;H01L21/56;H01L23/12;H01L23/29;H01L23/31;H01L23/48;H01L23/485;H01L23/488;H01L23/60;H01L25/065 |
主分类号 |
H01L23/50 |
| 代理机构 |
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代理人 |
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| 主权项 |
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