发明名称 SEMICONDUCTOR PACKAGE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent migration that is generated when a water resistance test is made by applying a bias to a package having a solder resist dam. SOLUTION: A cut-through part is provided at the appropriate place of a solder resist dam, and the solder resist dam is allowed to be intermittent in a dashed line shape.
申请公布号 JP2001326239(A) 申请公布日期 2001.11.22
申请号 JP20000144425 申请日期 2000.05.17
申请人 MITSUI CHEMICALS INC 发明人 TANAKA HIROBUMI;KUWABARA NAOKI;FUJITA KAZUTO;MORITA MORIJI
分类号 H01L23/12;H01L21/60 主分类号 H01L23/12
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