Epoxidharzzusammensetzung geeignet zur Verkapselung von Halbleiteranordnungen und harzverkapselte Halbleiteranordnungen

摘要

An epoxy resin composition for sealing a semiconductor device comprising a semiconductor element, a base to support the semiconductor element and an epoxy resin composition covering only one surface of the device opposite to the base, comprises (A) epoxy resin, (B) hardener and (C) inorganic filler, and gives a cured product which has (a) a flexural modulus of elasticity of 10 to 30 GPa at 23 DEG C and (b) a coefficient of linear expansion of 4 x 10<-6>/K to 10 x 10<-6>/K in a temperature range from 23 DEG C to the glass transition point, with the product of (a) and (b) being smaller than 2 x 10<-4> GPa/K.