发明名称 SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
摘要 A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a fin which comprises long sides and a first short side, a first trench which is immediately adjacent the first short side of the fin and has a first depth, a second trench which is immediately adjacent the first trench and has a second depth greater than the first depth, a first protrusion structure which protrudes from a bottom of the first trench and extends side by side with the first short side, and a gate which is formed on the first protrusion structure to extend side by side with the first short side.
申请公布号 US2016204106(A1) 申请公布日期 2016.07.14
申请号 US201614989876 申请日期 2016.01.07
申请人 YOU Jung-Gun;SUNG Sug-Hyun;PARK Se-Wan 发明人 YOU Jung-Gun;SUNG Sug-Hyun;PARK Se-Wan
分类号 H01L27/088;H01L29/423;H01L29/06 主分类号 H01L27/088
代理机构 代理人
主权项 1. A semiconductor device comprising: a fin which comprises long sides and a first short side; a first trench that is immediately adjacent the first short side of the fin and has a first depth; a second trench that is immediately adjacent the first trench and has a second depth that is greater than the first depth; a first protrusion structure that protrudes from a bottom of the first trench and extends side by side with the first short side; and a gate that is formed on the first protrusion structure to extend side by side with the first short side.
地址 Ansan-si KR