| 摘要 |
<p>PROBLEM TO BE SOLVED: To facilitate positioning at a correct position of electrode pad by providing a wiring board for forming a bump on an externally connected terminal with a non-through hole or recessed electrode pad comprising an insulating basic material and a surface coating conductor closing one end face of a hole passing through the insulating basic material. SOLUTION: A wiring board 10 for mounting an electronic part 40 has a terminal to be connected externally and a bump 45 is formed thereon. The wiring board comprises an insulating basic material 1, a through hole made therein, a surface coating conductor 3 closing one end face of the through hole, a conductor layer 4 in the closed non-through hole, and the nonthrough hole or a recessed electrode pad. The electrode pad on the lower surface coating conductor on the bump forming side is formed in the insulating basic material side from the surface of the wiring board with the central surface part being recessed so that a spherical bump 45 is fitted in the recessed electrode pad thus ensuring correct positioning.</p> |
