| 摘要 |
A stack type package is provided to reduce total thickness by inserting a plurality of chips into concave parts of a fork-shaped lead frame including the concave parts and convex parts. A pair of lead frames(110) are disposed opposite to each other. Each of the lead frames is formed with a shape of fork having concave parts and convex parts. A plurality of chips(120) are attached to an outer wall of each convex part by using a conductive adhesive. An EMC(Epoxy Molding Compound)(130) is used for sealing the chips and the lead frame including the chips. A plurality of projections(111) are formed on the outer walls of the convex parts. A plurality of grooves(121) are formed on the chips. The projections are coupled with the grooves. |
