POLYAMIDE RESIN, EPOXY RESIN COMPOSITIONS, AND CURED ARTICLES THEREOF

摘要

An aromatic polyamide resin having phenolic hydroxyl groups as represented by the general formula (1): (1) [wherein m and n in terms of averages satisfy the relationship: 0.005 < n/(m+n) < 0.05 and the sum of m and n is a positive number of 2 to 200; Ar1 is a divalent aromatic group; Ar2 is a divalent aromatic group having a phenolic hydroxyl group; and Ar3 is a divalent aromatic group]; and resin compositions (such as epoxy resin compositions) containing the polyamide resin. The polyamide resin little contains ionic impurities and is improved in adhesiveness without adversely affecting the excellent characteristics inherent in conventional aromatic polyamide resins having phenolic hydroxyl groups, e.g., the excellent flexibility, electrical characteristics, and flame retardance of cured articles of epoxy resin compositions containing the polyamide resins. ® KIPO & WIPO 2008