发明名称 Method for creating asymmetrical wafer
摘要 The present invention consists of a method for imparting asymmetry to a truncated annular wafer by either rounding one corner of the orientation flat, or rounding one corner of a notch. This novel method of rounding corners impart a visual and/or tactile asymmetry which can be utilized by a person in order to differentiate between the two different sides of the wafer. This inventive wafer design and method for making an asymmetric wafer is especially useful in the field of semiconductor technology and may be used on sapphire crystal wafers or any other class of wafer.
申请公布号 US9390906(B1) 申请公布日期 2016.07.12
申请号 US201314073602 申请日期 2013.11.06
申请人 Rubicon Technology, Inc. 发明人 Matthews Michael W.;Phatak Sunil B.
分类号 H01L29/04;H01L21/02 主分类号 H01L29/04
代理机构 Sunstein Kann Murphy & Timbers LLP 代理人 Sunstein Kann Murphy & Timbers LLP
主权项 1. A method of making a plurality of wafers, comprising the steps of: determining crystalline orientation of a substantially cylindrical crystal ingot; shaping at least one orientation flat upon said substantially cylindrical-crystal ingot; rounding at least one corner of said orientation flat to create a visual asymmetry to identify the determined crystalline orientation; and slicing said substantially cylindrical crystal ingot into a plurality of wafers, each of the plurality of wafers having at least one rounded corner.
地址 Bensenville IL US