发明名称 プリント配線板およびプリント配線板の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board which includes a pattern layer formed in a short task time and openings, and a method of manufacturing the same.SOLUTION: The printed wiring board includes: a pattern layer formed by subjecting a resin layer comprising an alkali-developable thermosetting resin composition containing a photobase generator to negative light irradiation and development; and openings formed by laser processing in the same layer as the pattern layer or another layer.
申请公布号 JP6010340(B2) 申请公布日期 2016.10.19
申请号 JP20120113863 申请日期 2012.05.17
申请人 太陽インキ製造株式会社 发明人 遠藤 新;峰岸 昌司;有馬 聖夫
分类号 H05K3/28;H05K3/00 主分类号 H05K3/28
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