| 摘要 |
PURPOSE: To improve product quality and rigidity while manufacture is allowed with little moving parts by exciting the first and second tips, and detecting a rotation of a tip, against a wafer surface, which shares a surface with the wafer, being vibrated in opposite phase from each other. CONSTITUTION: By etching a thin silicon wafer 10, the first (the second) tip 5 (6) comprising the first (the second) bar 13 (15) having an enclosure 12 and a tooth 14 (16) is formed. The teeth 14 and 16 of the tips 5 and 6 extend, mutually, in opposite direction and engage with each other. The bars 13 and 15 are connected with a traverse element 17, and these are connected to the enclosure 12 with a torsion support 18. The wafer 10 P-dopes at the bars 13 and 15 and teeth 14 and 16 area, and applies an electric potential to the tips 5 and 6, and the tips 5 and 6 are excited and vibrate with the wafer 10 in the shared plane in opposite phase, mutually. As a result, the support 18 is deformed with vibration and torsion. This is detected with a pressure resistor 22 on the support 18, and the vibration phase is compared to that of the tips 5 and 6, for deciding rotation direction. |
