发明名称 |
Verfahren und deren Maske zur Musterherstellung in einer Polymerschicht |
摘要 |
A method and system for fabricating micron and sub-micron-sized features within a polymer layer (402, 502) of a nascent semiconductor device or other micro-device or nano-device. Small features are directly imprinted with an optical-mechanical stamp (403, 503) having corresponding intrusions (204 - 207). Large features are created by exposing the surface of selected areas of the polymer surface (411, 520) to UV radiation by transmitting UV radiation through the optical-mechanical stamp to chemically alter the polymer, allowing either UV-exposed or UV-shielded areas to be removed by solvents. Thus, described embodiments of the present invention provide for a partially transparent imprinting mask that employs purely mechanical stamping for fine features and lithography-like chemical polymer removal for large features. <IMAGE> <IMAGE> <IMAGE> <IMAGE> |
申请公布号 |
DE60310460(T2) |
申请公布日期 |
2007.12.13 |
申请号 |
DE2003610460T |
申请日期 |
2003.01.23 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
MEI, PING;TAUSSIG, CARL P.;JEANS, ALBERT H. |
分类号 |
G03F1/08;G03F1/14;G03F7/00;G03F7/20;H01L21/027;H01L21/265;H01L21/336;H01L29/786 |
主分类号 |
G03F1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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