Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability

摘要

An enhanced thermal interface material (TIM) gap filler for filling a gap between two substrates (e.g., between a coldplate and an electronics module) includes microcapsules adapted to rupture in a magnetic field. The microcapsules, which are distributed in a TIM gap filler, each have a shell that encapsulates a solvent. One or more organosilane-coated magnetic nanoparticles is/are covalently bound into the shell of each microcapsule. In one embodiment, (3-aminopropyl) trimethylsilane-coated magnetite nanoparticles are incorporated into the shell of a urea-formaldehyde (UF) microcapsule during in situ polymerization. To enable easy removal of one substrate affixed to another substrate by the enhanced TIM gap filler, the substrates are positioned within a magnetic field sufficient to rupture the microcapsule shells through magnetic stimulation of the organosilane-coated magnetic nanoparticles. The ruptured microcapsule shells release the solvent, which dissolves and/or swells the TIM gap filler, thereby reducing the bond strength between the substrates.

主权项

1. An apparatus, comprising:
a first substrate; a second substrate; an enhanced thermal interface (TIM) gap filler disposed in a gap between the first substrate and the second substrate, wherein the enhanced TIM gap filler comprises a TIM gap filler and microcapsules distributed in the TIM gap filler, wherein each microcapsule has a shell encapsulating a solvent and into which one or more organosilane-coated magnetic nanoparticles is/are covalently bound.