FINE LINE METALLIZATION OF PHOTOVOLTAIC DEVICES BY PARTIAL LIFT-OFF OF OPTICAL COATINGS

摘要

Abstract of the Disclosure A method comprising: providing a substrate and a layer above the substrate; providing a patterned resist over the layer, the patterned resist exposing first portions of the layer and covering second portions of the layer; depositing a dielectric layer conformally over the patterned resist and the exposed first portions of the layer; providing one or more openings in the dielectric layer over the patterned resist, the one or more openings exposing a portion of the patterned resist; and exposing the patterned resist to a resist remover via the exposed portion of the patterned resist, thereby removing the patterned resist and the dielectric layer over the patterned resist, the removing exposing the second portions of the layer and leaving a substantially co-planar dielectric pattern over the first portions of the layer. 44 -42