SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE USING SEMICONDUCTOR PACKAGE

摘要

A semiconductor package and a method of manufacture thereof and the electronic device using the semiconductor package are provided to omit the solder ball formation process and wire bonding process by connecting the semiconductor packages with an electric connection medium. The semiconductor package comprises the first semiconductor package(500), and the second semiconductor package and the first electrical connection medium(140b). The second semiconductor package is laminated on the first semiconductor package. The first electrical connection medium is interposed between the first semiconductor package and the second semiconductor package. The first semiconductor package and the second semiconductor package are electrically connected to the first electrical connection medium. The empty space between the second semiconductor package and the first semiconductor package are occupied with the first electrical connection medium.