| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of cracks during solder flow by providing a particular area among the whole volume of a heat-resistant adhesive film between inner lead and semiconductor element. SOLUTION: This semiconductor device has 80% or more of the whole volume of the heat-resistant adhesive film located between an inner lead and a semiconductor element. Because of this, an adhesive film is adhered directly to a metallic plate for lead frame before processing to lead frame, and when processing to inner lead, an adhesive film between the inner leads is cut off at the same time, or an adhesive film between the inner leads is cut off after adhering an adhesive film to the inner lead. By doing this, the lead frame with an adhesive film becomes a semiconductor device where a low adhesion portion between semiconductor chips, unadhered portion disappears, and the cracks of sealing resin caused by this portion will not occur. |
